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Design tools for next-generation device developers [START] CAD design

CAD function that allows designing new structures.

From single-sided boards to high multilayer boards, configurations can be made without restrictions on layers or libraries. You can set up highly flexible layer structures with combinations of conductors and dielectrics. There is also a mode that can recognize pattern connections through three-dimensional contacts between layers, and various three-dimensional wiring options such as custom vias and bonding wires are equipped. A variety of placement objects can be used. - To accommodate a wide range of devices, a basic library that allows free registration and unique placement objects are provided. - A unique group of wire types: wide/narrow wires, filled solid (hierarchical settings), cut-out, inverted solid, taper lines, dotted/dashed lines, Bwire/Cwire (between layers). - 3D pad objects: pads set in three dimensions can be placed on wiring layers and output as 3D data (usable for IC leads and optical vias, etc.). ◆ The format of the SAVE data database (SSF) is published. Not only can you operate through the command menu, but you can also create the desired layer configuration and pattern shape simply by describing the specified format. *For details, please refer to the catalog available for download below "PDF Download."

• Company：ファースト
• Price：Other

• 2D CAD Electrical